Heteroepitaxy of Co-Based Heusler Compound/Muscovite for Flexible Spintronics

Chen YC, Yen M, Lai YH, Markou A, Zhang L, Chin YY, Lin HJ, Chen CT, Felser C, Chu YH (2019)


Publication Type: Journal article

Publication year: 2019

Journal

Book Volume: 11

Pages Range: 35162-35168

Journal Issue: 38

DOI: 10.1021/acsami.9b12219

Abstract

Materials with high spin-polarization play an important role in the development of spintronics. Co-based Heusler compounds are a promising candidate for practical applications because of their high Curie temperature and tunable half-metallicity. However, it is a challenge to integrate Heusler compounds into thin film heterostructures because of the lack of control on crystallinity and chemical disorder, critical factors of novel behaviors. Here, muscovite is introduced as a growth substrate to fabricate epitaxial Co2MnGa films with mechanical flexibility. The feature of heteroepitaxy is evidenced by the results of X-ray diffraction and transmission electron microscopy. Moreover, high chemical ordering with superior properties is delivered according to the observation of large Hall conductivity (680 ω-1 cm-1) and highly saturated magnetic moment (∼3.93 μB/f.u.), matching well with bulk crystals. Furthermore, the excellence of magnetic and electrical properties is retained under the various mechanical bending conditions. Such a result suggests that the development of Co2MnGa/muscovite heteroepitaxy provides not only a pathway to the thin film heterostructure based on high-quality Heusler compounds but also a new aspect of spintronic applications on flexible substrates.

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How to cite

APA:

Chen, Y.-C., Yen, M., Lai, Y.-H., Markou, A., Zhang, L., Chin, Y.-Y.,... Chu, Y.-H. (2019). Heteroepitaxy of Co-Based Heusler Compound/Muscovite for Flexible Spintronics. ACS Applied Materials and Interfaces, 11(38), 35162-35168. https://doi.org/10.1021/acsami.9b12219

MLA:

Chen, Yi-Cheng, et al. "Heteroepitaxy of Co-Based Heusler Compound/Muscovite for Flexible Spintronics." ACS Applied Materials and Interfaces 11.38 (2019): 35162-35168.

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