Determination of the true projected contact area by in situ indentation testing

Guillonneau G, Wheeler JM, Wehrs J, Philippe L, Baral P, Höppel HW, Göken M, Michler J (2019)


Publication Type: Journal article

Publication year: 2019

Journal

Book Volume: 34

Pages Range: 2859-2868

Journal Issue: 16

DOI: 10.1557/jmr.2019.236

Abstract

A major limitation in nanoindentation analysis techniques is the inability to accurately quantify pile-up/sink-in around indentations. In this work, the contact area during indentation is determined simultaneously using both contact mechanical models and direct in situ observation in the scanning electron microscope. The pile-up around indentations in materials with low H/E ratios (nanocrystalline nickel and ultrafine-grained aluminum) and the sink-in around a material with a high H/E ratio (fused silica) were quantified and compared to existing indentation analyses. The in situ projected contact area measured by scanning Eelectron Mmicroscopy using a cube-corner tip differs significantly from the classical models for materials with low H/E modulus ratio. Using a Berkovich tip, the in situ contact area is in good agreement with the contact model suggested by Loubet et al. for materials with low H/E ratio and in good agreement with the Oliver and Pharr model for materials with high H/E ratio.

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APA:

Guillonneau, G., Wheeler, J.M., Wehrs, J., Philippe, L., Baral, P., Höppel, H.W.,... Michler, J. (2019). Determination of the true projected contact area by in situ indentation testing. Journal of Materials Research, 34(16), 2859-2868. https://doi.org/10.1557/jmr.2019.236

MLA:

Guillonneau, Gaylord, et al. "Determination of the true projected contact area by in situ indentation testing." Journal of Materials Research 34.16 (2019): 2859-2868.

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