On the origin of charge compensation in aluminum-implanted n-type 4H-SiC by analysis of hall effect measurements

Weiße J, Hauck M, Sledziewski T, Krieger M, Bauer A, Mitlehner H, Frey L, Erlbacher T (2019)


Publication Type: Conference contribution

Publication year: 2019

Journal

Publisher: Trans Tech Publications Ltd

Book Volume: 963 MSF

Pages Range: 433-436

Conference Proceedings Title: Materials Science Forum

Event location: Birmingham GB

ISBN: 9783035713329

DOI: 10.4028/www.scientific.net/MSF.963.433

Abstract

Aluminum implanted 4H-SiC often shows an unexpected increase of the free hole density at elevated temperatures in Hall Effect measurements. Here, we exhibit that this phenomenon cannot solely be traced down to the Hall scattering factor and the presence of excited acceptor states. It is necessary to assume an additional defect center in the lower half of the band gap with ionization energies higher than that of aluminum to explain this behavior. Therefore, we investigated ionimplanted square van-der-Pauw samples with Hall Effect and complementary SIMS measurements. An analysis of the data using the neutrality equation reveals compensation ratios of 20 % to 90 %, depending on the aluminum concentration and the concentration of the deep defect center of up to 50 % of the doping.

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How to cite

APA:

Weiße, J., Hauck, M., Sledziewski, T., Krieger, M., Bauer, A., Mitlehner, H.,... Erlbacher, T. (2019). On the origin of charge compensation in aluminum-implanted n-type 4H-SiC by analysis of hall effect measurements. In Peter M. Gammon, Vishal A. Shah, Richard A. McMahon, Michael R. Jennings, Oliver Vavasour, Philip A. Mawby, Faye Padfield (Eds.), Materials Science Forum (pp. 433-436). Birmingham, GB: Trans Tech Publications Ltd.

MLA:

Weiße, Julietta, et al. "On the origin of charge compensation in aluminum-implanted n-type 4H-SiC by analysis of hall effect measurements." Proceedings of the 12th European Conference on Silicon Carbide and Related Materials, ECSCRM 2018, Birmingham Ed. Peter M. Gammon, Vishal A. Shah, Richard A. McMahon, Michael R. Jennings, Oliver Vavasour, Philip A. Mawby, Faye Padfield, Trans Tech Publications Ltd, 2019. 433-436.

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