SLA Printed 3D Waveguide Paths for E-Band using Electroless Silver Plating

Journal article
(Original article)


Publication Details

Author(s): Lomakin K, Herold S, Ringel L, Ringel J, Simon D, Sippel M, Sion A, Vossiek M, Helmreich K, Gold G
Journal: IEEE Transactions on Components, Packaging and Manufacturing Technology
Publication year: 2019
ISSN: 2156-3950
Language: English


Abstract



This work proposes a
fabrication approach for 3D printed waveguide paths based on a combination of
an optimized electroless silver plating process with a waveguide-specific
design rule for general metal plating by introducing large scale non- radiating
slots into the broad and narrow waveguide walls with a periodicity shorter than
quarter of the guided wavelength. Experimental fabrication of straight sections
of the proposed slotted waveguide with various gap dimensions yields an optimum
gap size as result of a trade-off between silver plating quality and leakage
losses through the sidewall gaps.



Moreover, a
successful practical application of the proposed approach is presented in terms
of a 3D printed multiple bend waveguide interconnect in three different space
dimensions which imposes a complex task for conventional manufacturing tech- niques
due to the need of multiple cutting planes for split block assembly. The
proposed approach benefits of low cost, moderate handling effort and
independence of the concrete geometry to manufacture making it therefore
especially interesting for distri- bution and feeding networks in the context
of rapid prototyping, automotive and space related applications.


FAU Authors / FAU Editors

Gold, Gerald Dr.-Ing.
Professur für Rechnergestützten Schaltungsentwurf
Helmreich, Klaus Prof. Dr.-Ing.
Professur für Rechnergestützten Schaltungsentwurf
Lomakin, Konstantin
Lehrstuhl für Hochfrequenztechnik
Ringel, Johannes
Lehrstuhl für Hochfrequenztechnik
Sippel, Mark
Lehrstuhl für Hochfrequenztechnik
Vossiek, Martin Prof. Dr.-Ing.
Lehrstuhl für Hochfrequenztechnik


External institutions with authors

NXP Semiconductors Germany GmbH


How to cite

APA:
Lomakin, K., Herold, S., Ringel, L., Ringel, J., Simon, D., Sippel, M.,... Gold, G. (2019). SLA Printed 3D Waveguide Paths for E-Band using Electroless Silver Plating. IEEE Transactions on Components, Packaging and Manufacturing Technology. https://dx.doi.org/10.1109/TCPMT.2019.2927671

MLA:
Lomakin, Konstantin, et al. "SLA Printed 3D Waveguide Paths for E-Band using Electroless Silver Plating." IEEE Transactions on Components, Packaging and Manufacturing Technology (2019).

BibTeX: 

Last updated on 2019-11-07 at 08:08