SLA Printed 3D Waveguide Paths for E-Band using Electroless Silver Plating

Lomakin K, Herold S, Ringel L, Ringel J, Simon D, Sippel M, Sion A, Vossiek M, Helmreich K, Gold G (2019)

Publication Language: English

Publication Type: Journal article, Original article

Publication year: 2019

Journal

IEEE Transactions on Components, Packaging and Manufacturing Technology Institute of Electrical and Electronics Engineers Inc.

Book Volume: 9

Pages Range: 2476-2481

Journal Issue: 12

DOI: 10.1109/TCPMT.2019.2927671

Abstract

This work proposes a fabrication approach for 3D printed waveguide paths based on a combination of an optimized electroless silver plating process with a waveguide-specific design rule for general metal plating by introducing large scale non- radiating slots into the broad and narrow waveguide walls with a periodicity shorter than quarter of the guided wavelength. Experimental fabrication of straight sections of the proposed slotted waveguide with various gap dimensions yields an optimum gap size as result of a trade-off between silver plating quality and leakage losses through the sidewall gaps.

Moreover, a successful practical application of the proposed approach is presented in terms of a 3D printed multiple bend waveguide interconnect in three different space dimensions which imposes a complex task for conventional manufacturing tech- niques due to the need of multiple cutting planes for split block assembly. The proposed approach benefits of low cost, moderate handling effort and independence of the concrete geometry to manufacture making it therefore especially interesting for distri- bution and feeding networks in the context of rapid prototyping, automotive and space related applications.

Authors with CRIS profile

Konstantin Lomakin Lehrstuhl für Hochfrequenztechnik Johannes Ringel Lehrstuhl für Hochfrequenztechnik Mark Sippel Lehrstuhl für Hochfrequenztechnik Martin Vossiek Lehrstuhl für Hochfrequenztechnik Klaus Helmreich Professur für Rechnergestützten Schaltungsentwurf Gerald Gold Professur für Rechnergestützten Schaltungsentwurf

Involved external institutions

NXP Semiconductors Germany GmbH DE Germany (DE)

How to cite

APA:

Lomakin, K., Herold, S., Ringel, L., Ringel, J., Simon, D., Sippel, M.,... Gold, G. (2019). SLA Printed 3D Waveguide Paths for E-Band using Electroless Silver Plating. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9(12), 2476-2481. https://dx.doi.org/10.1109/TCPMT.2019.2927671

MLA:

Lomakin, Konstantin, et al. "SLA Printed 3D Waveguide Paths for E-Band using Electroless Silver Plating." IEEE Transactions on Components, Packaging and Manufacturing Technology 9.12 (2019): 2476-2481.

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