Assessing the vibrational response and robustness of electronic systems by dissolving time and length scale

Conference contribution
(Conference Contribution)


Publication Details

Author(s): Schriefer T, Hofmann M
Editor(s): IEEE Electronics Packaging Society
Publication year: 2018
Language: English


Abstract

This paper presents a methodology to holistically analyse the effects of vibrational loads on electronic systems. An equivalent multi degree-of-freedom (DOF) damped system discretizes the complex structure and sets up the equation of motion. After modal testing the damping and stiffness coefficients, a numerical finite element model (FEM) is developed to identify critical components based on the mass participation factor. Including the system vibration behaviour by means of the characteristic transfer functions, the critical components are linear sub-modelled in the frequency domain to minimize calculation times. The statistical stress configuration caused by normally distributed random vibration cycles reveals electrical devices prone to significant damage. The mechanical damage in terms of high cycle fatigue is quantified in a second hierarchic linear submodel that considers both transfer functions and stress configuration of the critical components. By Inverse Fast Fourier transforming this input load from frequency to the time domain, it finally enables non-linear material models in the device submodel and the calculation of cumulative damage.


FAU Authors / FAU Editors

Schriefer, Thomas
Lehrstuhl für Elektronische Bauelemente


External institutions with authors

Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB)


How to cite

APA:
Schriefer, T., & Hofmann, M. (2018). Assessing the vibrational response and robustness of electronic systems by dissolving time and length scale. In IEEE Electronics Packaging Society (Eds.), Proceedings of the 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Toulouse, FR.

MLA:
Schriefer, Thomas, and Maximilian Hofmann. "Assessing the vibrational response and robustness of electronic systems by dissolving time and length scale." Proceedings of the 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Toulouse Ed. IEEE Electronics Packaging Society, 2018.

BibTeX: 

Last updated on 2019-08-05 at 17:10