Additional grain boundary strengthening in length-scale architectured copper with ultrafine and coarse domains

Journal article


Publication Details

Author(s): Hou X, Krauß S, Merle B
Journal: Scripta Materialia
Publication year: 2019
Volume: 165
Pages range: 55-59
ISSN: 1359-6462


Abstract

The strength of polycrystals is known to increase with decreasing grain size, known as Hall-Petch effect. However, this relationship fails to predict the strength of samples with a non-uniform distribution of grain sizes. In this study, we purposely designed and fabricated copper micropillars with a strongly bimodal microstructure: half volume consisted of a large number of ultrafine grains, while the other half was predominantly single-crystalline. Micropillar compression evidenced that bimodal samples are 35% stronger than their counterparts containing only ultrafine grains. This paradoxical finding highlights the greater strengthening potential of microstructure distribution engineering, compared to the traditional grain refinement strategy. (C) 2019 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.


FAU Authors / FAU Editors

Krauß, Sebastian
Lehrstuhl für Werkstoffwissenschaften (Allgemeine Werkstoffeigenschaften)
Merle, Benoit PD Dr. habil.
Lehrstuhl für Werkstoffwissenschaften (Allgemeine Werkstoffeigenschaften)


Additional Organisation
Interdisziplinäres Zentrum, Center for Nanoanalysis and Electron Microscopy (CENEM)


External institutions with authors

Coventry University


How to cite

APA:
Hou, X., Krauß, S., & Merle, B. (2019). Additional grain boundary strengthening in length-scale architectured copper with ultrafine and coarse domains. Scripta Materialia, 165, 55-59. https://dx.doi.org/10.1016/j.scriptamat.2019.02.019

MLA:
Hou, Xiaodong, Sebastian Krauß, and Benoit Merle. "Additional grain boundary strengthening in length-scale architectured copper with ultrafine and coarse domains." Scripta Materialia 165 (2019): 55-59.

BibTeX: 

Last updated on 2019-28-05 at 13:23