Analysis of Low Profile Ferrite Material Based Planar Shell Core Inductor

Umar Z, Engelsberger FX, Wojnowski M, Hagelauer AM, Weigel R (2018)

Publication Type: Conference contribution

Publication year: 2018

Publisher: IEEE

City/Town: NEW YORK

Pages Range: 634-637

Conference Proceedings Title: 2018 IEEE 20TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC)

Event location: Singapore SG

DOI: 10.1109/eptc.2018.8654356

Authors with CRIS profile

Amelie Marietta Hagelauer Lehrstuhl für Technische Elektronik Robert Weigel Lehrstuhl für Technische Elektronik

Involved external institutions

Infineon Technologies AG DE Germany (DE)

How to cite

APA:

Umar, Z., Engelsberger, F.X., Wojnowski, M., Hagelauer, A.M., & Weigel, R. (2018). Analysis of Low Profile Ferrite Material Based Planar Shell Core Inductor. In 2018 IEEE 20TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) (pp. 634-637). Singapore, SG: NEW YORK: IEEE.

MLA:

Umar, Zeeshan, et al. "Analysis of Low Profile Ferrite Material Based Planar Shell Core Inductor." Proceedings of the 20th IEEE Electronics Packaging Technology Conference (EPTC), Singapore NEW YORK: IEEE, 2018. 634-637.

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