Complex 3D structures via double imprint of hybrid structures and sacrificial mould techniques

Journal article


Publication Details

Author(s): Steinberg C, Rumler M, Manuel RA, Papenheim M, Wang S, Mayer A, Becker M, Rommel M, Scheer HC
Journal: Microelectronic Engineering
Publication year: 2017
Volume: 176
Pages range: 22-27
ISSN: 0167-9317


Abstract

The preparation of transparent complex 3D structures over large areas at low cost paves the way for numerous optical applications. We prepared nanostructures on the surface of microstructures in a negative tone photoresist by a double imprint process combined with VUV-induced surface hardening. Successful preparation of the aforementioned structures asks for a compromise between the surface hardening of the nanostructures and the replication fidelity of the microstructures. Our results show that a VUV treatment time of at least 3 s is required so that the cross-linked layer does not break-up. Adequate process parameters as well as their limiting values were identified by using high aspect ratio microstructures. The complex 3D structures were successfully replicated in UV-PDMS to provide long-term stable templates. To ensure effective separation despite of the undercuts a sacrificial mould technique is applied.


FAU Authors / FAU Editors

Rumler, Maximilian
Lehrstuhl für Elektronische Bauelemente


Additional Organisation
Exzellenz-Cluster Engineering of Advanced Materials


External institutions with authors

Bergische Universität Wuppertal
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB)
NanoWorld Services GmbH


Research Fields

B Nanoelectronic Materials
Exzellenz-Cluster Engineering of Advanced Materials


How to cite

APA:
Steinberg, C., Rumler, M., Manuel, R.A., Papenheim, M., Wang, S., Mayer, A.,... Scheer, H.-C. (2017). Complex 3D structures via double imprint of hybrid structures and sacrificial mould techniques. Microelectronic Engineering, 176, 22-27. https://dx.doi.org/10.1016/j.mee.2017.01.009

MLA:
Steinberg, Christian, et al. "Complex 3D structures via double imprint of hybrid structures and sacrificial mould techniques." Microelectronic Engineering 176 (2017): 22-27.

BibTeX: 

Last updated on 2019-15-03 at 20:08