Generation of 3D Functional Structures for High- Frequency Applications by Printing Technologies

Ankenbrand M, Scheetz M, Franke J, Lomakin K, Sippel M, Gold G, Helmreich K (2018)


Publication Language: English

Publication Type: Conference contribution, Conference Contribution

Publication year: 2018

DOI: 10.1109/ICMID.2018.8527052

Abstract

The following topics are dealt with: polymers; adhesion; rapid prototyping (industrial); mechatronics; aerosols; injection moulding; moulding; three-dimensional printing; metallisation; electrical resistivity.

Authors with CRIS profile

How to cite

APA:

Ankenbrand, M., Scheetz, M., Franke, J., Lomakin, K., Sippel, M., Gold, G., & Helmreich, K. (2018). Generation of 3D Functional Structures for High- Frequency Applications by Printing Technologies. In Proceedings of the 2018 13th International Congress Molded Interconnect Devices (MID).

MLA:

Ankenbrand, Markus, et al. "Generation of 3D Functional Structures for High- Frequency Applications by Printing Technologies." Proceedings of the 2018 13th International Congress Molded Interconnect Devices (MID) 2018.

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