A Survey on Reliability Assessment of Power Modules

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(Konferenzbeitrag)


Details zur Publikation

Autorinnen und Autoren: Khoshzaman S, Hahn I
Herausgeber: IEEE
Jahr der Veröffentlichung: 2018
Seitenbereich: 136-141
Sprache: Englisch


Abstract

The continuous increase in the requirements of power modules in industrial applications is the motivation to draw more attention towards reliability and the state-of-health assessment of them. The basics of conventional module packaging technology containing base plate, bond wires and solder layers and its limitations are reviewed in this paper. Typical end-of-life package-related failures are discussed. In addition, accelerated aging tests and common lifetime estimation models are reviewed.


FAU-Autorinnen und Autoren / FAU-Herausgeberinnen und Herausgeber

Hahn, Ingo Prof. Dr.-Ing.
Professur für Elektrische Antriebe und Maschinen
Khoshzaman, Shima
Professur für Elektrische Antriebe und Maschinen


Zitierweisen

APA:
Khoshzaman, S., & Hahn, I. (2018). A Survey on Reliability Assessment of Power Modules. In IEEE (Eds.), Proceedings of the 2018 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM) (pp. 136-141). Amalfi, Italy.

MLA:
Khoshzaman, Shima, and Ingo Hahn. "A Survey on Reliability Assessment of Power Modules." Proceedings of the 2018 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM), Amalfi, Italy Ed. IEEE, 2018. 136-141.

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Zuletzt aktualisiert 2019-18-04 um 00:23