A Survey on Reliability Assessment of Power Modules

Conference contribution
(Conference Contribution)


Publication Details

Author(s): Khoshzaman S, Hahn I
Editor(s): IEEE
Publication year: 2018
Pages range: 136-141
Language: English


Abstract

The continuous increase in the requirements of power modules in industrial applications is the motivation to draw more attention towards reliability and the state-of-health assessment of them. The basics of conventional module packaging technology containing base plate, bond wires and solder layers and its limitations are reviewed in this paper. Typical end-of-life package-related failures are discussed. In addition, accelerated aging tests and common lifetime estimation models are reviewed.


FAU Authors / FAU Editors

Hahn, Ingo Prof. Dr.-Ing.
Professur für Elektrische Antriebe und Maschinen
Khoshzaman, Shima
Professur für Elektrische Antriebe und Maschinen


How to cite

APA:
Khoshzaman, S., & Hahn, I. (2018). A Survey on Reliability Assessment of Power Modules. In IEEE (Eds.), Proceedings of the 2018 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM) (pp. 136-141). Amalfi, Italy.

MLA:
Khoshzaman, Shima, and Ingo Hahn. "A Survey on Reliability Assessment of Power Modules." Proceedings of the 2018 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM), Amalfi, Italy Ed. IEEE, 2018. 136-141.

BibTeX: 

Last updated on 2019-18-04 at 00:23