Adhesion Measurements for Printed Electronics: A Novel Approach to Cross Cut Testing

Conference contribution
(Conference Contribution)


Publication Details

Author(s): Schirmer J, Roudenko J, Reichenberger M, Neermann S, Franke J
Editor(s): IEEE Xplore
Publication year: 2018
Language: English


Abstract

A silver paste was screen-printed on flexible polyethylene terephthalate (PET) substrates, pretreated with different methods. The adhesion quality was evaluated by a modified cross cut test method implementing a motorized cutting device. Additionally, a semi automatized image analysis method was proposed for the evaluation of cross cut patterns in order to quantify the peeled-off area after tape removal. The feasibility of this novel approach is verified by comparing the results with a standard pull off test. The results show that by implementing image analysis methods the area of paste removed by the adhesive tape can be accurately calculated in an automated way, making it possible to gain quantifiable, user independent and therefore more significant results. Furthermore, the results from cross cut test and from pull off test show a similar trend.


FAU Authors / FAU Editors

Franke, Jörg Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Neermann, Simone
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


External institutions
Technische Hochschule Nürnberg "Georg Simon Ohm"


How to cite

APA:
Schirmer, J., Roudenko, J., Reichenberger, M., Neermann, S., & Franke, J. (2018). Adhesion Measurements for Printed Electronics: A Novel Approach to Cross Cut Testing. In IEEE Xplore (Eds.), . Zlatibor.

MLA:
Schirmer, Julian, et al. "Adhesion Measurements for Printed Electronics: A Novel Approach to Cross Cut Testing." Proceedings of the 41st International Spring Seminar on Electronics Technology (ISSE), Zlatibor Ed. IEEE Xplore, 2018.

BibTeX: 

Last updated on 2019-08-01 at 23:10