Vias in DBC Substrates for Embedded Power Modules

Bach HL, Yu Z, Letz S, Bayer C, Waltrich U, Schletz A, März M (2018)

Publication Language: English

Publication Type: Conference contribution, Conference Contribution

Publication year: 2018

Event location: Stuttgart

ISBN: 978-3-8007-4540-1

Abstract

This paper encompasses an evaluation of five different approaches to produce electrical vias in DBC (Direct Bonded

Copper) substrates. The investigated methods of producing vias are based on laser drilling of different via layouts in the

DBC substrates. In the next step, a stencil printing, dispensing and mechanical pressing process were tested for filling

the via holes. As filling material, copper, silver pastes and copper rivets were used to enable the electrical connection.

Before the experiments, electrical simulations have been performed in order to analyse the optimal via layout in the

DBC substrates. It could be validated that at high frequency range (1 GHz), the current density distribution improves

through the increase of via pitch, via diameter and via numbers. Combined with silver paste as filling material, the

electrical characteristics of produced blind-hole vias could be improved compared to the use of copper paste and copper

rivets. In conclusion, potential application possibilities for vias in DBC substrate, like three-dimensional power

modules, multilayer DBC stacks and chip embedding concepts are discussed.

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How to cite

APA:

Bach, H.L., Yu, Z., Letz, S., Bayer, C., Waltrich, U., Schletz, A., & März, M. (2018). Vias in DBC Substrates for Embedded Power Modules. In VDE (Eds.), Proceedings of the 2018 10th International Conference on Integrated Power Electronics Systems (CIPS). Stuttgart, DE.

MLA:

Bach, Hoang Linh, et al. "Vias in DBC Substrates for Embedded Power Modules." Proceedings of the 2018 10th International Conference on Integrated Power Electronics Systems (CIPS), Stuttgart Ed. VDE, 2018.

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