Antenna and Package Design for 61 GHz and 122 GHz Radar Sensors in Embedded Wafer-Level Ball Grid Array Technology

Frank M, Reißland T, Lurz F, Völkel M, Lambrecht F, Kiefl S, Ghesquiere P, Ng H, Kissinger D, Weigel R, Kölpin A (2018)


Publication Language: English

Publication Status: Accepted

Publication Type: Journal article, Original article

Future Publication Type: Journal article

Publication year: 2018

Journal

Publisher: IEEE

Edited Volumes: IEEE Transactions on Microwave Theory and Techniques

Book Volume: 66

Pages Range: 5156-5168

Journal Issue: 12

DOI: 10.1109/TMTT.2018.2873368

Authors with CRIS profile

Related research project(s)

How to cite

APA:

Frank, M., Reißland, T., Lurz, F., Völkel, M., Lambrecht, F., Kiefl, S.,... Kölpin, A. (2018). Antenna and Package Design for 61 GHz and 122 GHz Radar Sensors in Embedded Wafer-Level Ball Grid Array Technology. IEEE Transactions on Microwave Theory and Techniques, 66(12), 5156-5168. https://doi.org/10.1109/TMTT.2018.2873368

MLA:

Frank, Martin, et al. "Antenna and Package Design for 61 GHz and 122 GHz Radar Sensors in Embedded Wafer-Level Ball Grid Array Technology." IEEE Transactions on Microwave Theory and Techniques 66.12 (2018): 5156-5168.

BibTeX: Download