Monolithic 3D TSV-based high-voltage, high-temperature capacitors

Gruenler S, Rattmann G, Erlbacher T, Bauer AJ, Frey L (2016)

Publication Status: Published

Publication Type: Journal article, Original article

Publication year: 2016

Journal

Microelectronic Engineering Elsevier

Publisher: Elsevier B.V.

Book Volume: 156

Pages Range: 19-23

DOI: 10.1016/j.mee.2016.02.008

Authors with CRIS profile

Lothar Frey Lehrstuhl für Elektronische Bauelemente

Involved external institutions

Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB) DE Germany (DE)

How to cite

APA:

Gruenler, S., Rattmann, G., Erlbacher, T., Bauer, A.J., & Frey, L. (2016). Monolithic 3D TSV-based high-voltage, high-temperature capacitors. Microelectronic Engineering, 156, 19-23. https://dx.doi.org/10.1016/j.mee.2016.02.008

MLA:

Gruenler, Saeideh, et al. "Monolithic 3D TSV-based high-voltage, high-temperature capacitors." Microelectronic Engineering 156 (2016): 19-23.

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