Compact Substrate Integrated Wireless Cure Monitoring Sensor for Epoxy Resin

Conference contribution


Publication Details

Author(s): Groh J, Lee W, Schür JS, Distler F, Vossiek M
Publication year: 2018
Conference Proceedings Title: 48th European Microwave Conference (EuMW 2018)
Language: English


FAU Authors / FAU Editors

Distler, Felix
Lehrstuhl für Hochfrequenztechnik
Groh, Jannis
Lehrstuhl für Hochfrequenztechnik
Lee, William
Lehrstuhl für Hochfrequenztechnik
Schür, Jan Steffen Dr.-Ing.
Lehrstuhl für Hochfrequenztechnik
Vossiek, Martin Prof. Dr.-Ing.
Lehrstuhl für Hochfrequenztechnik


How to cite

APA:
Groh, J., Lee, W., Schür, J.S., Distler, F., & Vossiek, M. (2018). Compact Substrate Integrated Wireless Cure Monitoring Sensor for Epoxy Resin. In 48th European Microwave Conference (EuMW 2018).

MLA:
Groh, Jannis, et al. "Compact Substrate Integrated Wireless Cure Monitoring Sensor for Epoxy Resin." Proceedings of the 48th European Microwave Conference (EuMW 2018) 2018.

BibTeX: 

Last updated on 2019-18-07 at 07:34

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