Compact Substrate Integrated Wireless Cure Monitoring Sensor for Epoxy Resin

Groh J, Lee W, Schür J, Distler F, Vossiek M (2018)


Publication Language: English

Publication Type: Conference contribution

Publication year: 2018

Conference Proceedings Title: 48th European Microwave Conference (EuMW 2018)

DOI: 10.23919/EuMC.2018.8541434

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How to cite

APA:

Groh, J., Lee, W., Schür, J., Distler, F., & Vossiek, M. (2018). Compact Substrate Integrated Wireless Cure Monitoring Sensor for Epoxy Resin. In 48th European Microwave Conference (EuMW 2018).

MLA:

Groh, Jannis, et al. "Compact Substrate Integrated Wireless Cure Monitoring Sensor for Epoxy Resin." Proceedings of the 48th European Microwave Conference (EuMW 2018) 2018.

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