Substituting bond wires by additively manufactured interconnections

Conference contribution


Publication Details

Author(s): Lomakin K, Sippel M, Gold G, Ringel J, Weiß D, Helmreich K, Ankenbrand M, Franke J
Publication year: 2018
Conference Proceedings Title: German Microwave Conference
Language: English


Abstract

This work shows a comparison of microstrip to integrated circuits
junction between conventional bond wires and additively manufactured
signal interconnect. Therefore, an approach for reducing signal
reflection is proposed and implemented on a test board fabricated on
typical radio frequency substrate material. Measurements up to 24 GHz
reveal improved performance as compared to conventional technology in
terms of reflection suppression and transmission losses.


FAU Authors / FAU Editors

Ankenbrand, Markus
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Franke, Jörg Prof. Dr.-Ing.
Helmreich, Klaus Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Gold, Gerald Dr.-Ing.
Professur für Rechnergestützten Schaltungsentwurf
Professur für Rechnergestützten Schaltungsentwurf
Lomakin, Konstantin
Lehrstuhl für Hochfrequenztechnik
Ringel, Johannes
Lehrstuhl für Hochfrequenztechnik
Sippel, Mark
Lehrstuhl für Hochfrequenztechnik


How to cite

APA:
Lomakin, K., Sippel, M., Gold, G., Ringel, J., Weiß, D., Helmreich, K.,... Franke, J. (2018). Substituting bond wires by additively manufactured interconnections. In German Microwave Conference.

MLA:
Lomakin, Konstantin, et al. "Substituting bond wires by additively manufactured interconnections." Proceedings of the German Microwave Conference 2018.

BibTeX: 

Last updated on 2019-01-02 at 08:23