Substituting bond wires by additively manufactured interconnections

Lomakin K, Sippel M, Gold G, Ringel J, Weiß D, Helmreich K, Ankenbrand M, Franke J (2018)


Publication Language: English

Publication Type: Conference contribution

Publication year: 2018

Conference Proceedings Title: German Microwave Conference

DOI: 10.23919/gemic.2018.8335106

Abstract

This work shows a comparison of microstrip to integrated circuits junction between conventional bond wires and additively manufactured signal interconnect. Therefore, an approach for reducing signal reflection is proposed and implemented on a test board fabricated on typical radio frequency substrate material. Measurements up to 24 GHz reveal improved performance as compared to conventional technology in terms of reflection suppression and transmission losses.

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How to cite

APA:

Lomakin, K., Sippel, M., Gold, G., Ringel, J., Weiß, D., Helmreich, K.,... Franke, J. (2018). Substituting bond wires by additively manufactured interconnections. In German Microwave Conference.

MLA:

Lomakin, Konstantin, et al. "Substituting bond wires by additively manufactured interconnections." Proceedings of the German Microwave Conference 2018.

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