New Simulation Procedure for Accurate Package Modeling Considering Chip-Package Interaction

Seler E, Wojnowski M, Weigel R, Hagelauer AM (2013)

Publication Type: Conference contribution

Publication year: 2013

Publisher: IEEE

Pages Range: 43-46

Conference Proceedings Title: IEEE Conference Electrical Performance of Electronic Packaging and Systems

Event location: San Jose

DOI: 10.1109/EPEPS.2013.6703463

Authors with CRIS profile

Ernst Seler Lehrstuhl für Technische Elektronik Robert Weigel Lehrstuhl für Technische Elektronik Amelie Marietta Hagelauer Lehrstuhl für Technische Elektronik

How to cite

APA:

Seler, E., Wojnowski, M., Weigel, R., & Hagelauer, A.M. (2013). New Simulation Procedure for Accurate Package Modeling Considering Chip-Package Interaction. In IEEE Conference Electrical Performance of Electronic Packaging and Systems (pp. 43-46). San Jose, US: IEEE.

MLA:

Seler, Ernst, et al. "New Simulation Procedure for Accurate Package Modeling Considering Chip-Package Interaction." Proceedings of the IEEE Conference Electrical Performance of Electronic Packaging and Systems, San Jose IEEE, 2013. 43-46.

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