Integrated Test for Silicon Front Ends

Journal article

Publication Details

Author(s): Kissinger D, Lämmle B, Maurer L, Weigel R
Journal: IEEE Microwave Magazine
Publisher: IEEE
Publication year: 2010
Volume: 11
Journal issue: 3
Pages range: 87-94
ISSN: 1527-3342


Silicon-based technologies have enabled the monolithic integration of transceiver circuits with operational frequencies up into the millimeter-wave regime. While high integration relaxes the requirements on RF chip-to-chip interconnects and external circuitry, it imposes serious challenges upon the traceability of failure mechanisms and functional errors of the individual building blocks that comprise the front-end. Additionally, expensive external measurement equipment in combination with complex, error-prone, and time-consuming calibration procedures, necessitates the development of on-chip test modules. It has been shown that a variety of built-in test schemes are currently the topic of research for both the mixed-signal and microwave domain. Solutions for the individual building blocks that will enable direct verification of performance parameters have been presented throughout this article. Current RF transceiver architectures will require a mixture of both paradigms for successful implementation of integrated test strategies. It is the authors' belief that the application of such concepts is a must for future integrated transceiver systems to meet the stringent requirements of time-to-market and low-cost of mass market consumer products.

FAU Authors / FAU Editors

Kissinger, Dietmar Prof. Dr.-Ing.
Lehrstuhl für Technische Elektronik
Lämmle, Benjamin Dr.
Lehrstuhl für Technische Elektronik
Weigel, Robert Prof. Dr.-Ing.
Lehrstuhl für Technische Elektronik

External institutions with authors

Universität der Bundeswehr München

How to cite

Kissinger, D., Lämmle, B., Maurer, L., & Weigel, R. (2010). Integrated Test for Silicon Front Ends. IEEE Microwave Magazine, 11(3), 87-94.

Kissinger, Dietmar, et al. "Integrated Test for Silicon Front Ends." IEEE Microwave Magazine 11.3 (2010): 87-94.


Last updated on 2018-25-08 at 07:12