Syed Khaja AH, Walawski D, Stoll T, Franke J (2016)
Publication Language: English
Publication Status: Published
Publication Type: Conference contribution, Conference Contribution
Publication year: 2016
Publisher: Institute of Electrical and Electronics Engineers Inc.
Article Number: 7738929
ISBN: 9781509054282
DOI: 10.1109/ICMID.2016.7738929
Molded interconnect device (MID) technology is a key enabling technology with growing markets in automotive, communications, consumer electronics through integration with lighting and sensor technologies. Additive manufacturing (AM) is also a key technology as energy, material and resource efficient alternative to conventional subtractive and formative production technologies. In this contribution, powder-based additive layered manufacturing mainly selective laser melting (SLM) is focused to check the potential for substrate manufacturing, system integration and packaging concepts in electronic systems particularly for high-temperature MID applications. The challenge for an optimal mechatronic integrated device design is to simultaneously consider both the application-specific requirements and to integrate advantages of MID technology. This work focuses on the process development for the generation of conductive patterns on ceramic substrates by SLM technique. The process influencing parameters such as laser power, velocity and scan concepts were tested to check the bonding characteristics. The obtained layer thicknesses and the corresponding process-generated failure mechanisms and the mechanical stability are presented. The potential of SLM for high temperature applicability is further discussed. The influences of the printed powder height, laser parameters in combination with laser scan strategies and pattern height are discussed. The hurdles and prospects of SLM as alternative for functionalization are highlighted and discussed.
APA:
Syed Khaja, A.H., Walawski, D., Stoll, T., & Franke, J. (2016). Is selective laser melting (SLM) an alternative for high-temperature mechatronic integrated devices? methodology, hurdles and prospects. In Proceedings of the 12th International Congress on Molded Interconnect Devices, MID 2016. Institute of Electrical and Electronics Engineers Inc..
MLA:
Syed Khaja, Aarief Hussain, et al. "Is selective laser melting (SLM) an alternative for high-temperature mechatronic integrated devices? methodology, hurdles and prospects." Proceedings of the 12th International Congress on Molded Interconnect Devices, MID 2016 Institute of Electrical and Electronics Engineers Inc., 2016.
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