The impact of the material distribution of porousified {LTCC} on the effective permittivity investigated by finite 3D field simulation

Steinhäußer F, Talai A, Kölpin A, Weigel R, Bittner A, Schmid U (2013)


Publication Type: Conference contribution

Publication year: 2013

Publisher: GMM VDE/VDI-Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik

Event location: Aachen

ISBN: 978-3-8007-3555-6

Abstract

Apart from other advantages, such as its robustness, the high permittivity of LTCC (Low Temperature Cofired Ceramics) multi layer technology is one of the most important reasons why it is nowadays well established in high frequency devices and systems. However, reduced emission is not desired in every application. Antennas require a substrate with a low permittivity in order to achieve maximum emitter efficiencies. The chemical composition of LTCC allows the local introduction of air by means of a selective etch process. Due to this selective and diffusion controlled process the generated porousification is not homogeneous depending on the penetration depth. On the basis of measured lateral material distributions, the effect on the effective permittivity can be shown by performing 3D field simulations. The distributions are graphically derived from material cuts, which were realized by focused ion beam technology. From the complex trends, conclusion regarding the alteration of the inner chemical phase distribution as well as the quality and the bearing capability of the surface can be obtained.

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How to cite

APA:

Steinhäußer, F., Talai, A., Kölpin, A., Weigel, R., Bittner, A., & Schmid, U. (2013). The impact of the material distribution of porousified {LTCC} on the effective permittivity investigated by finite 3D field simulation. In Proceedings of the Mikrosystemtechnik-Kongress (MST). Aachen: GMM VDE/VDI-Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik.

MLA:

Steinhäußer, Frank, et al. "The impact of the material distribution of porousified {LTCC} on the effective permittivity investigated by finite 3D field simulation." Proceedings of the Mikrosystemtechnik-Kongress (MST), Aachen GMM VDE/VDI-Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik, 2013.

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