Seler E, Wojnowski M, Sommer G, Weigel R (2012)
Publication Type: Conference contribution
Publication year: 2012
Pages Range: 99-102
Conference Proceedings Title: IEEE 14th Electronics Packaging Technology Conference (EPTC)
Event location: Singapore, SG
DOI: 10.1109/EPTC.2012.6507059
Embedded Wafer Level Ball Grid Array (eWLB) is one of the most advantageous packaging technologies with respect to higher I/O density, process easiness, integration flexibilities and electrical performance. When it comes to high-frequency (HF), the latter has to be considered particularly. The Quad Flat no Leads Package (VQFN) has often been the choice due to good HF-performance. We present the comparison of the two package technologies eWLB and VQFN. In this paper we present an optimized 24 GHz chip-package-board transition. We compare the performance of an eWLB package to a VQFN package. We focus on a single-ended transition. We obtain a simulated insertion loss better than -0.5 dB in eWLB compared to -1.5 dB in VQFN. In this contribution we show the outstanding potential of the eWLB package for mm-wave applications.
APA:
Seler, E., Wojnowski, M., Sommer, G., & Weigel, R. (2012). Comparative Analysis of High-Frequency Transitions in Embedded Wafer Level BGA (eWLB) and Quad Flat no Leads (VQFN) Packages. In IEEE 14th Electronics Packaging Technology Conference (EPTC) (pp. 99-102). Singapore, SG.
MLA:
Seler, Ernst, et al. "Comparative Analysis of High-Frequency Transitions in Embedded Wafer Level BGA (eWLB) and Quad Flat no Leads (VQFN) Packages." Proceedings of the IEEE 14th Electronics Packaging Technology Conference (EPTC), Singapore, SG 2012. 99-102.
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