Wideband RF Interconnects for Organic Chip Packages - Comparison of single ended and differential transitions

Röhrl FX, Bogner W, Jakob J, Hageneder D (2015)

Publication Type: Conference contribution, Original article

Publication year: 2015

Event location: Paris FR

URI: http://ieeexplore.ieee.org/document/7345880/

DOI: 10.1109/EuMC.2015.7345880

Open Access Link: http://ieeexplore.ieee.org/document/7345880/

Abstract

Embedding of semiconductor chips into organic substrates allows a cheap and high degree of miniaturization. For RF applications the connection between chip and package is as important as the connection between package and baseboard. This paper presents both single ended and differential transitions for RF packages with special reference to what should be considered when using organic printed circuit boards (PCBs). Because of the fully impedance controlled design process the presented transitions can be used from DC to 60 GHz and guarantee best signal integrity. In addition a fast and flexible measurement of the package - baseboard transition is shown by the use of a specific contact structure. Moreover it is figured out how the discontinuities of the interconnect structure of the chip package can be localized in detail using TDR measurements.

Authors with CRIS profile

Franz Xaver Röhrl Lehrstuhl für Technische Elektronik

Involved external institutions

Hochschule für angewandte Wissenschaften Deggendorf (HDU) DE Germany (DE) Rohde & Schwarz GmbH & Co. KG DE Germany (DE)

How to cite

APA:

Röhrl, F.X., Bogner, W., Jakob, J., & Hageneder, D. (2015). Wideband RF Interconnects for Organic Chip Packages - Comparison of single ended and differential transitions. In Proceedings of the European Microwave Conference (EuMC). Paris, FR.

MLA:

Röhrl, Franz Xaver, et al. "Wideband RF Interconnects for Organic Chip Packages - Comparison of single ended and differential transitions." Proceedings of the European Microwave Conference (EuMC), Paris 2015.

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