Modeling and simulation of curing and damage in thermosetting adhesives

Journal article


Publication Details

Author(s): Mergheim J, Possart G, Steinmann P
Journal: Journal of Adhesion
Publisher: Taylor & Francis: STM, Behavioural Science and Public Health Titles / Taylor & Francis
Publication year: 2013
Volume: 89
Pages range: 111
ISSN: 0021-8464


FAU Authors / FAU Editors

Mergheim, Julia PD Dr.
Professur für Computational Mechanics
Possart, Gunnar Dr.-Ing.
Lehrstuhl für Technische Mechanik
Steinmann, Paul Prof. Dr.-Ing.
Lehrstuhl für Technische Mechanik


How to cite

APA:
Mergheim, J., Possart, G., & Steinmann, P. (2013). Modeling and simulation of curing and damage in thermosetting adhesives. Journal of Adhesion, 89, 111.

MLA:
Mergheim, Julia, Gunnar Possart, and Paul Steinmann. "Modeling and simulation of curing and damage in thermosetting adhesives." Journal of Adhesion 89 (2013): 111.

BibTeX: 

Last updated on 2018-09-08 at 15:53