Schmidt C (2011)
Publication Type: Journal article
Publication year: 2011
Book Volume: 1
Pages Range: 65-78
Journal Issue: 1
DOI: 10.3390/met1010065
The formation of alloys by particle reinforcement during accumulative roll bonding (ARB), and subsequent annealing, is introduced on the basis of the binary alloy system Al-Cu, where strength and electrical conductivity are examined in different microstructural states. An ultimate tensile strength (UTS) of 430 MPa for Al with 1.4 vol.% Cu was reached after three ARB cycles, which almost equals UTS of the commercially available Al-Cu alloy AA2017A with a similar copper content. Regarding electrical conductivity, the UFG structure had no significant influence. Alloying of aluminum with copper leads to a linear decrease in conductivity of 0.78 µΩ·cm/at.% following the Nordheim rule. On the copper-rich side, alloying with aluminum leads to a slight strengthening, but drastically reduces conductivity. A linear decrease of electrical conductivity of 1.19 µΩ·cm/at.% was obtained.
APA:
Schmidt, C. (2011). Particle based alloying by accumulative roll bonding in the system Al-Cu. Metals, 1(1), 65-78. https://dx.doi.org/10.3390/met1010065
MLA:
Schmidt, Christian. "Particle based alloying by accumulative roll bonding in the system Al-Cu." Metals 1.1 (2011): 65-78.
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