Stress-Aware Module Placement on Reconfigurable Devices

Conference contribution


Publication Details

Author(s): Angermeier J, Ziener D, Glaß M, Teich J
Title edited volumes: Proceedings - 21st International Conference on Field Programmable Logic and Applications, FPL 2011
Publisher: IEEE Computer Society
Publishing place: New York, NY, USA
Publication year: 2011
Conference Proceedings Title: Proceedings of the International Conference on Field-Programmable Logic and Applications
Pages range: 277-281
ISBN: 978-1-4577-1484-9


Abstract


A lot of research has been spent on improving the reliability and extending the lifetime of ASIC and SoC devices, but only little on improving the long-term reliability of dynamically reconfigurable systems. In order to increase the lifetime of a reconfigurable device, we propose a placement strategy to distribute the stress equally on the reconfigurable resources at runtime such that all have a similar level of degradation. Thereby, we present a new aging model which is applied to estimate the influence of aging effects on dynamically reconfigurable devices, and which can be evaluated at runtime, while providing quite accurate aging results. Furthermore, we present a new stress-aware placement algorithm that takes the degradation of the reconfigurable resources into account and can significantly extend the lifetime of reconfigurable devices. © 2011 IEEE.



FAU Authors / FAU Editors

Angermeier, Josef Dr.-Ing.
Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design)
Glaß, Michael Prof. Dr.-Ing.
Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design)
Teich, Jürgen Prof. Dr.-Ing.
Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design)
Ziener, Daniel Dr.-Ing.
Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design)


How to cite

APA:
Angermeier, J., Ziener, D., Glaß, M., & Teich, J. (2011). Stress-Aware Module Placement on Reconfigurable Devices. In Proceedings of the International Conference on Field-Programmable Logic and Applications (pp. 277-281). Chania, Crete, GR: New York, NY, USA: IEEE Computer Society.

MLA:
Angermeier, Josef, et al. "Stress-Aware Module Placement on Reconfigurable Devices." Proceedings of the International Conference on Field Programmable Logic and Applications (FPL'11), Chania, Crete New York, NY, USA: IEEE Computer Society, 2011. 277-281.

BibTeX: 

Last updated on 2018-19-04 at 02:52