Talai A, Weigel R, Kölpin A (2017)
Publication Language: English
Publication Status: Submitted
Publication Type: Conference contribution, Abstract of lecture
Future Publication Type: Conference contribution
Publication year: 2017
Publisher: IEEE
Book Volume: vol
Conference Proceedings Title: Workshop on Recent Progresses in mmW Multilayer Circuit and System Design and Packaging (MCM/SoP)
Event location: Honolulu, Hawai
Journal Issue: no
Low Temperature Cofired Ceramics (LTCC) is a high-frequency material type that is suitable for multilayer structures and applications. Since its relative permittivity is usually in the region of 6 to 10, microwave structures can be designed in a space-saving way. The implementation of patch-antennas on LTCC, such as radar antennas at 77 GHz, require a lower permittivity in order to achieve a desirable efficiency and focusing capability. Therefore, this presentation will focus on a novel method of using the multilayer capabilities of LTCC in order to decrease the local permittivity below the antennas. Before sintering, carbon inserts are embedded on inner layers below the antennas by using an Nd:YAG laser. It will be demonstrated that these inserts are burned out completely during sintering and the cavity remains. The process requires an adaption of the sintering profile in order to reduce the sinking of the substrate in the middle of the cavity. Within this presentation, the achievable improvements on antenna beams will be presented by comparative simulation results of 77 GHz antennas with and without the embedded cavity. Furthermore, presented measurement results will verify the effects of the cavity.
APA:
Talai, A., Weigel, R., & Kölpin, A. (2017, June). Efficient radar front-end implementation in LTCC multilayer cavity technology. Paper presentation at IEEE/MTT-S International Microwave Symposium (IMS), Honolulu, Hawai, US.
MLA:
Talai, Armin, Robert Weigel, and Alexander Kölpin. "Efficient radar front-end implementation in LTCC multilayer cavity technology." Presented at IEEE/MTT-S International Microwave Symposium (IMS), Honolulu, Hawai Ed. IEEE, IEEE, 2017.
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