Pulse Plated Silver Metallization on Porosified Low Temperature Co-fired Ceramics for High Frequency Applications

Journal article


Publication Details

Author(s): Steinhäußer F, Talai A, Sandulache G, Weigel R, Kölpin A, Hansal W, Bittner A, Schmid U
Journal: Microelectronics Reliability
Publisher: Elsevier
Publication year: 2016
Volume: 60
Pages range: 93-100
ISSN: 0026-2714


Abstract


Advanced high frequency systems such as needed in modern radar applications, require high conductive metallizations as well as substrates with areas of variable permittivity. This paper presents the combination of the selective porosification technology of low temperature co-fired ceramics and electro pulse plated silver microstrip lines. By means of selective plating methods, line widths of 20 μm can be manufactured featuring low resistivity values down to 2.33 μΩ·cm, without detectable pore penetration. The substrate permittivity is measured facilitating a combined method of ring resonator detuning and 3D field simulations resulting in a reduction of 6.5\% with a shift from approx. 7.52 to 7.03 at 66 GHz due to the porosification. As often outlined in literature the major challenge in using silver as a conductor lies in its high tendency of agglomeration and microstructural transformation especially in oxygen containing atmosphere even at low temperatures. Therefore, the effect of different temperature loads up to 500°C on the dc film resistivity are measured using the VAN DER PAUW technique and compared to scanning electron microscope analyses.



FAU Authors / FAU Editors

Kölpin, Alexander PD Dr.
Lehrstuhl für Technische Elektronik
Talai, Armin
Lehrstuhl für Technische Elektronik
Weigel, Robert Prof. Dr.-Ing.
Lehrstuhl für Technische Elektronik


External institutions with authors

Technische Universität Wien


How to cite

APA:
Steinhäußer, F., Talai, A., Sandulache, G., Weigel, R., Kölpin, A., Hansal, W.,... Schmid, U. (2016). Pulse Plated Silver Metallization on Porosified Low Temperature Co-fired Ceramics for High Frequency Applications. Microelectronics Reliability, 60, 93-100. https://dx.doi.org/10.1016/j.microrel.2016.02.010

MLA:
Steinhäußer, Frank, et al. "Pulse Plated Silver Metallization on Porosified Low Temperature Co-fired Ceramics for High Frequency Applications." Microelectronics Reliability 60 (2016): 93-100.

BibTeX: 

Last updated on 2018-06-08 at 18:38