The Impact of embedded wafer level BGA Package on the Antenna Performance

Pour Mousavi SM, Wojnowski M, Agethen R, Weigel R, Hagelauer AM (2013)

Publication Type: Conference contribution

Publication year: 2013

Publisher: IEEE

Pages Range: 828-831

Event location: Torino IT

DOI: 10.1109/APWC.2013.6624913

Authors with CRIS profile

Seyed Mehran Pour Mousavi Lehrstuhl für Technische Elektronik Roman Agethen Lehrstuhl für Technische Elektronik Robert Weigel Lehrstuhl für Technische Elektronik Amelie Marietta Hagelauer Lehrstuhl für Technische Elektronik

How to cite

APA:

Pour Mousavi, S.M., Wojnowski, M., Agethen, R., Weigel, R., & Hagelauer, A.M. (2013). The Impact of embedded wafer level BGA Package on the Antenna Performance. In Proceedings of the IEEE-APS Topical Conference on Antennas and Propagation in Wireless Communications (APWC) (pp. 828-831). Torino, IT: IEEE.

MLA:

Pour Mousavi, Seyed Mehran, et al. "The Impact of embedded wafer level BGA Package on the Antenna Performance." Proceedings of the IEEE-APS Topical Conference on Antennas and Propagation in Wireless Communications (APWC), Torino IEEE, 2013. 828-831.

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