Bare Die Connections via Aerosol Jet Technology for Millimeter Wave Applications

Röhrl FX, Jakob J, Bogner W, Weigel R, Zorn S (2018)

Publication Language: English

Publication Status: Accepted

Publication Type: Conference contribution, Conference Contribution

Future Publication Type: Conference contribution

Publication year: 2018

Publisher: IEEE

Pages Range: 4

Event location: Madrid ES

ISBN: 978-2-87487-051-4

URI: https://ieeexplore.ieee.org/document/8541697

DOI: 10.23919/EuMC.2018.8541697

Open Access Link: https://ieeexplore.ieee.org

Abstract

This paper presents a comparison of chip connections using Aerosol Jet (AJ) and Bond technology on low cost PCB substrates. First, the behavior of the used gap filler material and the used silver ink on printed circuit boards are characterized. In addition to comparing the RF performance (DC to 67 GHz) of the two technologies, the mechanical stability is also compared. While the AJ technology transitions score above all for their RF performance and the lower requirements (surface finish, pad size and adhesion) on the PCB, the bonding technology has clear advantages, especially with different coefficient of thermal expansion (CTE) values of the substrates to be connected. Finally, the measurement results of a complete package are shown, whereby the chip connection is realized once by means of aerosol jet and once by bonding wires.

Authors with CRIS profile

Franz Xaver Röhrl Lehrstuhl für Technische Elektronik Robert Weigel Lehrstuhl für Technische Elektronik Stefan Zorn Lehrstuhl für Technische Elektronik

Involved external institutions

Hochschule für angewandte Wissenschaften Deggendorf (HDU) DE Germany (DE)

How to cite

APA:

Röhrl, F.X., Jakob, J., Bogner, W., Weigel, R., & Zorn, S. (2018). Bare Die Connections via Aerosol Jet Technology for Millimeter Wave Applications. In Proceedings of the European Microwave Conference (pp. 4). Madrid, ES: IEEE.

MLA:

Röhrl, Franz Xaver, et al. "Bare Die Connections via Aerosol Jet Technology for Millimeter Wave Applications." Proceedings of the European Microwave Conference, Madrid IEEE, 2018. 4.

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