Thomas Kuhn



Organisationseinheit


Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


Publikationen (Download BibTeX)

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Fischer, A., Kuhn, T., Drummer, D., & Franke, J. (2018). Effect of talc on the metal adhesion of laser-structured polymer parts. In Proceedings of the 13th International Congress Molded Interconnect Devices. Würzburg.
Fischer, A., Kuhn, T., Müller, H., Drummer, D., Franke, J., & Zimmermann, A. (2017). Effect of flow lines on the metallization of laser structured polymer parts. In SPE Proceedings Antec. Anaheim, US.
Kuhn, T., & Franke, J. (2017). Influences of Crack Initiation in Conductor Tracks on Three-Dimensional Thermoplastic Substrates. In IEEE (Eds.), Proceedings of the SMTA Pan Pacific Microelectronics Symposium.
Kuhn, T., Krügelstein, A., & Franke, J. (2016). Mechatronic Integrated Devices Produced by Laser Direct Structuring on Powder-Coated Aluminum Substrates. In IEEE (Eds.), Proceedings of 39th International Spring Seminar on Electronics Technology (ISSE 2016) (pp. 27--32).
Goth, C., & Kuhn, T. (2015). Räumlich und mit feiner Struktur: Die 3D-Technologie auf dem Vormarsch. Kunststoffe, 105(6), 92--97.
Goth, C., & Kuhn, T. (2015). Three-Dimensional and with a Fine Structure: 3-D Technology on the Rise. Kunststoffe International, 6-7, 76--80.
Franke, J., Spahr, M., Kuhn, T., & Hörber, J. (2014). Additive Manufacturing Technologies for Functionalized Mechatronic Integrated Devices. In Franke J, Kuhn T, Birkicht A, Pojtinger A (Eds.), 11th International Congress Molded Interconnect~Devices. Nürnberg: Trans Tech Publications.
Goth, C., Kuhn, T., Gion, G., & Franke, J. (2014). Hot Pin Pull Method - New Test Procedure for the Adhesion Measurement for 3D-MID. In Franke J, Kuhn T, Birkicht A, Pojtinger A (Eds.), 11th International Congress Molded Interconnect Devices (pp. 115--120). Pfaffikon: Trans Tech Publications Ltd.
Fischer, A., Müller, H., Kuhn, T., Drummer, D., Kück, H., & Franke, J. (2014). Reliability of LDS Conductor Paths - Influencing Factors and Characterization Methods. In Franke J, Kuhn T, Birkicht A, Pojtinger A (Eds.), 11th International Congress Molded Interconnect Devices. Fürth: Nürnberg.
Kuhn, T., & Franke, J. (2014). Test Methods and Influencing Factors for the Adhesion Strength Measurement of Metallized Structures on Thermoplastic Substrates. In IEEE (Eds.), Proceedings of the 16th Electronics Packaging Technology Conference (EPTC) (pp. 655--660).

Zuletzt aktualisiert 2017-31-07 um 11:05