Simone Neermann

Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Lehrstuhl für Informationsübertragung

A Transmission Method for Conductivity Extraction of Printed Silver Ink (2022) Ehrngruber M, Neermann S, Gold G Conference contribution, Conference Contribution Evaluation of detatchable board-to-board interconnects on screen printed electronic structures (2021) Schirmer J, Huemmer M, Klauss M, Neermann S, Reichenberger M, Franke J Journal article Conformable Electronics: Thermoforming and Injection Molding of Electronic Components (2021) Schirmer J, Reichenberger M, Neermann S, Franke J Conference contribution Sintering of conductive inks on plastic substrates by use of microwave furnaces being suitable for largescale production processes (2021) Hartmann L, Sabban J, Behrendt F, Tatai TM, Neermann S, Franke J, Dreyer C Conference contribution Generation of Printed Electronics on Thermal Sensitive Substrates by Laser Assisted Sintering of Nanoparticle Inks (2021) Mayer E, Stichel T, Roth S, Neermann S, Franke J, Schmidt M Conference contribution RF Characterization of the Homogeneity of Sintered Micro- And Nanoparticle Silver Inks for Printed Electronics (2021) Neermann S, Franke J, Sippel M, Lomakin K, Gold G Conference contribution Evaluation of Mechanical Stress on Electronic Assemblies during Thermoforming and Injection Molding for Conformable Electronics (2021) Schirmer J, Reichenberger M, Wimmer A, Reichel H, Neermann S, Franke J Conference contribution Sintering of digitally printed silver nanoparticle inks on flexible and rigid substrates by NIR- And UVradiation (2021) Roudenko J, Neermann S, Schirmer J, Reichenberger M, Franke J Conference contribution Reliability of Printed Microwave Electronics (2021) Neermann S, Franke J, Sippel M, Lomakin K, Gold G Conference contribution Qualification of NIR, UV and Laser Irradiation as Alternative Photonic Sintering Methods for Printed Electronics (2020) Neermann S, Steindl M, Franke J, Mayer E, Schmidt M Conference contribution