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Daniel Utsch
List of publications:
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Chair of Engineering Design (KTmfk)
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)
Publications
(13)
Types of publications
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Journal article
Journal article
Book chapter / Article in edited volumes
Book chapter / Article in edited volumes
Authored book
Authored book
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Translation
Thesis
Thesis
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Edited Volume
Conference contribution
Conference contribution
Other publication type
Other publication type
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Unpublished / Preprint
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Assessment and improvement of adhesion of printed silver-based inks on alumina produced by fused filament fabrication (2024)
Utsch D, Sippel M, Voigt C, Häußler F, Franke J
Journal article
Mechanical qualification and microstructural analysis of alumina produced by material extrusion (2023)
Utsch D, Bründl P, Franke J, Erdogan H
Journal article
Optimizing Adhesion of Printed Conductive Lines on Additively Manufactured Ceramics (2023)
Utsch D, Häußler F, Voigt C, Sippel M, Franke J
Conference contribution, Conference Contribution
Reliability of Piezojet-Printed Conductive Lines on Alumina Substrates Produced by Fused Filament Fabrication (2023)
Utsch D, Häußler F, Sprenger M, Zirn J, Franke J
Conference contribution
Generation of RF Structures on Additively Manufactured Substrates by Printed Electronics and Laser Structuring (2023)
Ankenbrand M, Panusch D, Utsch D, Banea K, Ehrngruber M, Gold G, Helmreich K, Franke J
Conference contribution, Conference Contribution
Investigations on processing copper-titanium powder blends via PBF-LB/M (2023)
Hecht C, Schüller D, Utsch D, Stoll T, Franke J
Book chapter / Article in edited volumes
Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components (2023)
Voigt C, Petersen M, Thielen N, Utsch D, Häußler F, Kirchberger M, Franke J
Conference contribution, Conference Contribution
Additive4Industry - Printed electronics on 3D substrates. Mit keramischen Materialien zu temperaturbeständigeren elektronischen Baugruppen (2022)
Utsch D
Other publication type
Additive Manufacturing of 3D Circuit Carriers with Improved Thermal Conductivity (2022)
Utsch D, Piechulek N, Franke J
Conference contribution
Herstellung räumlicher Schaltungsträger mit keramischen Materialien mittels digitaler Fertigungsverfahren (2022)
Utsch D, Milich N, Ankenbrand M, Franke J
Conference contribution, Conference Contribution
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