Konstantin Lomakin



Organisation


Lehrstuhl für Hochfrequenztechnik


Publications (Download BibTeX)

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Lomakin, K., Pavlenko, T., Ankenbrand, M., Sippel, M., Ringel, J., Scheetz, M.,... Gold, G. (2018). Evaluation and Characterization of 3D Printed Pyramid Horn Antennas utilizing different Deposition Techniques for Conductive Material. IEEE Transactions on Components, Packaging and Manufacturing Technology, 1-1. https://dx.doi.org/10.1109/tcpmt.2018.2871931
Ankenbrand, M., Scheetz, M., Franke, J., Lomakin, K., Sippel, M., Gold, G., & Helmreich, K. (2018). Generation of 3D Functional Structures for High- Frequency Applications by Printing Technologies. In Proceedings of the 2018 13th International Congress Molded Interconnect Devices (MID).
Lomakin, K., Pavlenko, T., Sippel, M., Gold, G., Helmreich, K., Ankenbrand, M.,... Franke, A. (2018). Impact of Surface Roughness on 3D printed SLS Horn Antennas. In European Conference on Antennas and Propagation (EUCAP).
Lomakin, K., Sippel, M., Gold, G., Fröhlich, J., Helmreich, K., Ankenbrand, M., & Franke, J. (2018). Low reflective aerosol Jet printed broadband matched load up to 67 GHz. In German Microwave Conference.
Lomakin, K., Sippel, M., Gold, G., Ringel, J., Weiß, D., Helmreich, K.,... Franke, J. (2018). Substituting bond wires by additively manufactured interconnections. In German Microwave Conference.
Köppel, M., Deckelmann, M., Sippel, M., Lomakin, K., Werzinger, S., Gold, G.,... Schmauß, B. (2018). Using coherent optical frequency domain reflectometry to assist the additive manufacturing process of structures for radio frequency applications. In SPIE Optics + Photonics: Optical Engineering + Applications. San Diego, US.
Sippel, M., Lomakin, K., Gold, G., & Helmreich, K. (2017). Characteristics of Anisotropic Conducting Polymers Suggest Feasibility of Test Fixtures up to 110 GHz. Electronics. https://dx.doi.org/10.3390/electronics6040109
Sippel, M., Lomakin, K., Gold, G., Reitberger, T., Neermann, S., & Helmreich, K. (2017). Simple Approach for brief RF Characterization of thin 3D printable Dielectrics. In 21st IEEE Workshop on Signal and Power Integrity (SPI 2017). Baveno, IT.

Last updated on 2019-23-01 at 23:52