Konstantin Lomakin



Organisationseinheit


Lehrstuhl für Hochfrequenztechnik


Publikationen (Download BibTeX)

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Lomakin, K., Guschlbauer, R., Osmanlic, F., Fu, Z., Sippel, M., Helmreich, K.,... Gold, G. (2019). 3D Printed Copper Waveguides by Selective Electron Beam Melting Process for E-Band. In Proceedings of the EuMW 2019. Paris.
Lomakin, K., Herold, S., Simon, D., Sippel, M., Sion, A., Vossiek, M.,... Gold, G. (2019). 3D Printed Slotted Rectangular Hollow Waveguides. In Proceedings of the 2019 IEEE MTT-S International Microwave Symposium. Boston, USA, US.
Gold, G., Lomakin, K., Helmreich, K., & Arz, U. (2019). High-Frequency Modeling of Coplanar Waveguides Including Surface Roughness. Advances in Radio Science, 17.
Lomakin, K., Ankenbrand, M., Sippel, M., Franke, J., Helmreich, K., & Gold, G. (2019). Nanojet 3D Printed Coplanar Waveguides on Flexible Polyimide Substrate up to 24 GHz. (Unpublished, Accepted).
Lomakin, K., Pavlenko, T., Sippel, M., Gold, G., Weidner, T., Helmreich, K.,... Franke, J. (2018). 3D Printed Helix Antenna. In European Conference on Antennas and Propagation (EUCAP). London, GB.
Lomakin, K., Simon, D., Sippel, M., Gold, G., Helmreich, K., Seler, E.,... Reuter, R. (2018). 3D Printed Slotted Waveguide Array Antenna for Automotive Radar Applications in W-Band. In 48th European Microwave Conference (EuMW 2018).
Lomakin, K., Gold, G., & Helmreich, K. (2018). Analytical Waveguide Model Precisely Predicting Loss and Delay Including Surface Roughness. IEEE Transactions on Microwave Theory and Techniques. https://dx.doi.org/10.1109/tmtt.2018.2827383
Ankenbrand, M., Franke, J., Lomakin, K., Pavlenko, T., Sippel, M., Gold, G.,... Helmreich, K. (2018). Erzeugung von 3D-Funktionsstrukturen fuer Hochfrequenzanwendungen durch Druckverfahren. PLUS - Produktion von Leiterplatten und Systemen.
Lomakin, K., Pavlenko, T., Ankenbrand, M., Sippel, M., Ringel, J., Scheetz, M.,... Gold, G. (2018). Evaluation and Characterization of 3D Printed Pyramid Horn Antennas utilizing different Deposition Techniques for Conductive Material. IEEE Transactions on Components, Packaging and Manufacturing Technology, 1-1. https://dx.doi.org/10.1109/tcpmt.2018.2871931
Ankenbrand, M., Scheetz, M., Franke, J., Lomakin, K., Sippel, M., Gold, G., & Helmreich, K. (2018). Generation of 3D Functional Structures for High- Frequency Applications by Printing Technologies. In Proceedings of the 2018 13th International Congress Molded Interconnect Devices (MID).

Zuletzt aktualisiert 2019-23-01 um 23:52

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