Daniel Gräf

Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

Development and application of load profiles for thermal qualification testing of receptacle automotive connectors (2021) Friedlein M, Gräf D, Stegner J, Franke J Journal article New concept for the Integration of Additive Manufactured Mechanical and Mechatronic Components in Aircraft Interior Systems (2020) Gräf D, Friedlein M, Gänßmantel C, Franke J, Ischdonat N Conference contribution, Conference Contribution Customizable Capacitive Sensor System Using Printed Electronics on Window Glass (2020) Fröhlich J, Gräf D, Franke J, Hörber J, Hedges M Conference contribution Occurrence and Influence of Fretting Corrosion on Receptacle Contact Resistance (2018) Friedlein M, Gräf D, Jaumann A, Raiser F, Franke J Conference contribution, Conference Contribution Pushing the Boundaries of 3D-MID: Pulse-Width Modulated Light Technology for Enhancing Surface Properties and Enabling Printed Electronics on FFF-Printed Structures (2018) Gräf D, Neermann S, Stuber L, Scheetz M, Franke J Conference contribution Influences of Manufacturing Sequences for the Application of Printed Electronics on Aircraft Interior Components (2018) Ischdonat N, Dreyer C, Gräf D, Franke J, Horber J, Hedges M Conference contribution Evaluation and Characterization of 3D Printed Pyramid Horn Antennas utilizing different Deposition Techniques for Conductive Material (2018) Lomakin K, Pavlenko T, Ankenbrand M, Sippel M, Ringel J, Scheetz M, Klemm T, et al. Journal article, Review article Additive Fertigung in der Hochfrequenztechnik – Potenziale und Herausforderungen (2017) Lomakin K, Sippel M, Gold G, Rochholz P, Helmreich K, Ankenbrand M, Gräf D, Franke J Journal article Data and Power Distribution via Printed Electronics in Aerospace Applications (2017) Gräf D, Ischdonat N, Hedges M, Hörber J, Franke J Conference contribution, Conference Contribution Cabin Interior Components as Substrate Material for Printed Electrical Circuits (2017) Ischdonat N, Gräf D, Gleine W, Dreyer C, Bauer M, Franke J Conference contribution