Christopher Kästle



Organisation


Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


Publications (Download BibTeX)

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Kästle, C., Blank, T., Sedlmair, J., Weber, M., & Franke, J. (2016). Optimierung der Anlagen- und Prozessparameter für die zuverlässige Auslegung kupferbasierter sequenzieller Chip-Verbindungen in der Leistungselektronik. In DVS (Eds.), Jahrbuch Mikroverbindungstechnik 2016/ 2017 (pp. 65 - 81). Düsseldorf: DVS Media.
Kästle, C., Blank, T., Sedlmair, J., Weber, M., & Franke, J. (2016). Optimierung der Anlagen- und Prozessparameter für die zuverlässige Fertigung kupferbasierter sequentieller Chip-Verbindungen in der Leistungselektronik. In GMM/ DVS (Eds.), Elektronische Baugruppen und Leiterplatten - EBL (pp. 52 - 58). Fellbach, DE.
Syed Khaja, A.H., Kästle, C., Müller, M., & Franke, J. (2015). A Comprehensive Study on the Automation Potentials and Complexities of Advanced and Alternative Die-Attach Technologies for Power Electronic Applications. Applied Mechanics and Materials, 794, 320 - 327. https://dx.doi.org/10.4028/www.scientific.net/AMM.794.320
Kästle, C., Losch, T., & Franke, J. (2015). Evaluation of Influencing Factors on the Heavy Wire Bondability of Plasma Printed Copper Structures. In IEEE (Eds.), Proceedings of the 17th Electronics Packaging and Technology Conference (EPTC). Singapur, SG.
Kästle, C., Hörber, J., Öchsner, F., & Franke, J. (2015). Prospects of wire bonding as an approach for contacting additive manufactured Aerosol Jet printed structures. In IMAPS (Eds.), Proceedings of the 20th European Microelectronics Packaging Conference (EMPC). Friedrichshafen, DE.
Kästle, C., & Franke, J. (2014). Comparative Analysis of the Process Window of Aluminum and Copper Wire Bonding for Power Electronics Applications. In IEEE (Eds.), Proceeding of the 2014 International Conference on Electronics Packaging (ICEP) (pp. 335 - 340). Toyama, JP.
Syed Khaja, A.H., & Kästle, C. (2014). Design and solder process optimization in MID technology for high power applications. Trans Tech Publications Ltd.
Kästle, C., Syed Khaja, A.H., Reinhardt, A., & Franke, J. (2013). Investigations on Ultrasonic Copper Wire Wedge Bonding for Power Electronics. In IEEE (Eds.), Proceedings of the 36th International Spring Seminar on Electronics Technology (ISSE) (pp. 79 - 84). Alba Iulia, RO.
Syed Khaja, A.H., Kästle, C., Reinhardt, A., & Franke, J. (2013). Optimized thin-film diffusion soldering for power-electronics production. (pp. 11-16). Alba Iulia, Romania: IEEE Computer Society.
Syed Khaja, A.H., Kästle, C., & Franke, J. (2013). Reliable packaging technologies for power electronics: Diffusion soldering and heavy copper wire bonding. Nuremberg: IEEE Computer Society.

Last updated on 2017-27-07 at 10:19