Christopher Kästle



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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

From
To

Abstract

Journal

Investigations on the Additive Manufacturing and Heavy Wire Bonding Capability of Selective Laser-Melted Circuit Carriers (2017) Kästle C, Syed Khaja AH, Franke J Journal article Feasibility Investigations on Selective Laser Melting for the Development of Microchannel Cooling in Power Electronics (2017) Syed Khaja AH, Perinan Freire A, Kästle C, Franke J Conference contribution, Conference Contribution Intelligent vernetzte Elektronikproduktion (2017) Bogner E, Kästle C, Beitinger G, Franke J Book chapter / Article in edited volumes Challenges of the Miniaturization in the Electronics Production on the example of 01005 Components (2017) Niemann J, Härter S, Kästle C, Franke J Conference contribution, Conference Contribution Cyber-Physical Electronics Production (2017) Kästle C, Fleischmann H, Scholz M, Härter S, Franke J Book chapter / Article in edited volumes Investigations on Wire Bonding Capability of Selective Laser Melted Structures (2016) Kästle C, Syed Khaja AH, Franke J Conference contribution, Conference Contribution Model Factory for Additive Manufacturing of Mechatronic Products: Interconnecting World-Class Technology Partnerships with Leading AM Players (2016) Yoo IS, Braun T, Kästle C, Spahr M, Kestel P, Wartzack S, Franke J, et al. Conference contribution, Conference Contribution Optimierung der Anlagen- und Prozessparameter für die zuverlässige Fertigung kupferbasierter sequentieller Chip-Verbindungen in der Leistungselektronik (2016) Kästle C, Blank T, Sedlmair J, Weber M, Franke J Conference contribution, Conference Contribution Enhanced Organizational Ambidexterity in Electronics Manufacturing through the Automation of Production-Related Processes (2016) Bogner E, Kästle C, Franke J Conference contribution, Conference Contribution Optimierung der Anlagen- und Prozessparameter für die zuverlässige Auslegung kupferbasierter sequenzieller Chip-Verbindungen in der Leistungselektronik (2016) Kästle C, Blank T, Sedlmair J, Weber M, Franke J Book chapter / Article in edited volumes