Martin Muckelbauer

Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

High Temperature Die Attach: Study and Power Cycling of Direct-Bonded Silver Joints (2022) Häußler F, Sippel M, Sprenger M, Liu L, Muckelbauer M, Franke J Conference contribution Manufacturing of Ceramic Based Mechatronic Integrated Devices Using Laser-Direct-Structuring (2022) Bräuer P, Stoll T, Muckelbauer M, Häußler F, Hensel A, Franke J Conference contribution Pretreatment and Structuring of Spatial Circuit Carriers Based on Alumina for High Temperatures and High Frequencies (2022) Bräuer P, Stoll T, Muckelbauer M, Hensel A, Franke J Conference contribution Examining Ag-Ag Direct Bonding on Chemically Coated DBC Substrates as a Pasteless Die-Attach Approach (2021) Häußler F, Schöttner J, Schubert J, Muckelbauer M, Spiecker E, Franke J Conference contribution, Conference Contribution Innovative Approach of efficient low-temperature silver sintering on an industrial series scale for simultaneous die top and bottom level interconnections of power electronic applications (2019) Müller M, Franke J Conference contribution Reliability of Molded Interconnect Devices regarding Crack Initiation and Overmolding (2019) Bräuer P, Kuhn T, Müller M, Franke J Conference contribution Feasability study of piezo jet printed silver ink structures for interconnection and condition monitoring of power electronics components (2018) Müller M, Franke J Conference contribution Innovative Approach of efficient High Humidity and High Temperature Reverse Bias Testing as significant Qualification Method for Power Electronic Modules (2018) Müller M, Franke J Conference contribution Einfluss der Beschichtungssequenz auf die Bauteiltemperatur während eines plasmabasierten Kupferbeschichtungsprozesses auf unterschiedlichen Substratmaterialien (2018) Hensel A, Müller M, Franke J Conference contribution System Concept of a Robust and Reproducible Plasma-Based Coating Process for the Manufacturing of Power Electronic Applications (2017) Hensel A, Müller M, Franke J, Kohlmann-von Platen K Conference contribution, Conference Contribution