Robert Süß-Wolf

Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

Simulation Assisted Characterization of Attenuation at Microstrip Transmission Lines fabricated by Laser Direct Structuring (2021) Wang L, Lomakin K, Job A, Süß-Wolf R, Gold G, Franke J Conference contribution Additive Manufacturing of Coplanar Transmission Lines on Alumina Substrate up to 24 GHz using Laser Assisted Selective Metallization (2021) Lomakin K, Wang L, Job A, Süß-Wolf R, Franke J, Helmreich K, Gold G Conference contribution, Conference Contribution Development and Validation of a Material Application Tool for the Covering Process of a Wire Harness (2020) Heisler P, Hausecker E, Regler J, Süß-Wolf R, Franke J Conference contribution Prediction of surface roughness of laser selective metallization of ceramics by multiple linear regression and artificial neural networks approaches (2020) Wang L, Silva L, Süß-Wolf R, Franke J Journal article Innovative signal and power connection solutions for alternative powertrain concepts (2020) Fröhlig S, Piechulek N, Friedlein M, Süß-Wolf R, Schmidt L, Kuhn M, Wang L, et al. Conference contribution, Conference Contribution Innovative Solutions for the Covering Process in the Manufacturing of Wire Harnesses to Increase the Automation Degree (2020) Heisler P, Kuhn M, Süß-Wolf R, Franke J Conference contribution, Conference Contribution Robot-based automated production of wrapped connections with single solid round wires (2019) Hefner F, Herbert M, Sjarov M, Süß-Wolf R, Franke J Book chapter / Article in edited volumes Laser-Associated Selective Metallization of Ceramic Surface With Infrared Nanosecond Laser Technology (2019) Wang L, Fu Z, Süß-Wolf R, Travitzky N, Greil P, Franke J Journal article, Editorial Novel Ceramic-Based Material for the Applications of Molded Interconnect Devices (3D-MID) Based on Laser Direct Structuring (2018) Bachy B, Süß-Wolf R, Wang L, Fu Z, Travitzky N, Greil P, Franke J Journal article Investigation of the laser ablation threshold for optimizing Laser Direct Structuring in the 3D-MID technology (2018) Wang L, Süß-Wolf R, Ulm M, Franke J Conference contribution, Original article