Christian Heidorn



Organisation


Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design)


Project member


(TRR 89: Invasive Computing):
TCPA_INT: Integration and Coupling of Tightly Coupled Processor Arrays (T01)
PD Dr.-Ing. Frank Hannig; Prof. Dr.-Ing. Jürgen Teich
(01/03/2017 - 29/02/2020)

TRR 89: DFG SFB/Transregio 89 "Invasive Computing"
Prof. Dr.-Ing. Jürgen Teich
(01/07/2010 - 30/06/2022)


Publications ()


Heidorn, C., Esteve, R., Höchbauer, T., Krieger, M., Weber, H.B., & Rupp, R. (2019). Basal plane dislocation conversion enhancement in 4H-SiC homoepitaxial layers by ion implantation into the wafer. In Peter M. Gammon, Vishal A. Shah, Richard A. McMahon, Michael R. Jennings, Oliver Vavasour, Philip A. Mawby, Faye Padfield (Eds.), Materials Science Forum (pp. 114-118). Birmingham, GB: Trans Tech Publications Ltd.
Schwarzer, T., Falk, J., Müller, S., Letras, M., Heidorn, C., Wildermann, S., & Teich, J. (2019). Compilation of Dataflow Applications for Multi-Cores using Adaptive Multi-Objective Optimization. ACM Transactions on Design Automation of Electronic Systems, 24(3). https://dx.doi.org/10.1145/3310249
Heidorn, C., Witterauf, M., Hannig, F., & Teich, J. (2019). Efficient Mapping of CNNs onto Tightly Coupled Processor Arrays. Journal of Computers, 14(8), 541-556. https://dx.doi.org/10.17706/jcp.14.8.541-556
Höchbauer, T., Heidorn, C., & Tsavdaris, N. (2019). New SiC epitaxial growth process with up to 100% BPD to TED defect conversion on 150mm hot-wall CVD reactor. In Peter M. Gammon, Vishal A. Shah, Richard A. McMahon, Michael R. Jennings, Oliver Vavasour, Philip A. Mawby, Faye Padfield (Eds.), Materials Science Forum (pp. 123-126). Birmingham, GB: Trans Tech Publications Ltd.

Last updated on 2018-02-06 at 04:36