Materials Science in Semiconductor Processing

Journal Abbreviation: MAT SCI SEMICON PROC
ISSN: 1369-8001
Publisher: Elsevier


Volume: 91, Pages range: 9-12
An adhesive bonding approach by hydrogen silsesquioxane for silicon carbide-based LED applications (2019)
Lin L, Ou Y, Jokubavicius V, et al.

Volume: 90, Pages range: 205-211
Wavelength-selective 4H-SiC UV-sensor array (2019)
Matthus CD, Bauer AJ, Frey L, et al.

Volume: 78, Pages range: 57-68
From thin film to bulk 3C-SiC growth: Understanding the mechanism of defects reduction (2018)
La Via F, Severino A, Anzalone R, et al.

Volume: 29, Pages range: 124-131
Improved electrical behavior of ZrO2-based MIM structures by optimizing the O3 oxidation pulse time (2015)
Paskaleva A, Weinreich W, Bauer A, et al.

Last updated on 2015-29-05 at 16:47