IEEE Transactions on Components, Packaging and Manufacturing Technology

ISSN: 2156-3985
eISSN: 2156-3950
Publisher: Institute of Electrical and Electronics Engineers Inc.

Publications (5)

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Types of publications

Journal article
Unpublished / Preprint

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Abstract

Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz (2024) Pfahler T, Breun S, Engel L, Geissler C, Schür J, Vossiek M Journal article Hybrid Additive Manufacturing by Embedded Electrical Circuits Using 3-D Dispensing (2021) Schmidt K, Polzinger B, Metry M, Koppe S, Zimmermann A Journal article SLA Printed 3D Waveguide Paths for E-Band using Electroless Silver Plating (2019) Lomakin K, Herold S, Ringel L, Ringel J, Simon D, Sippel M, Sion A, et al. Journal article, Original article Evaluation and Characterization of 3D Printed Pyramid Horn Antennas utilizing different Deposition Techniques for Conductive Material (2018) Lomakin K, Pavlenko T, Ankenbrand M, Sippel M, Ringel J, Scheetz M, Klemm T, et al. Journal article, Review article High-Q Inductors Embedded in the Fan-Out Area of an eWLB (2012) Wojnowski M, Issakov V, Knoblinger G, Pressel K, Sommer G, Weigel R Journal article