Technische Hochschule Nürnberg "Georg Simon Ohm"


Universität / Hochschule

Standort der Organisation:
Nürnberg, Deutschland


Forschungsprojekte mit FAU-Wissenschaftlerinnen und Wissenschaftlern


(Energie Campus Nürnberg):
EnCN 2 TP SP 2: Spitzenlastfähige Hochtemperatur-Speicher
Prof. Dr.-Ing. Jürgen Karl
(01.01.2017 - 31.12.2021)
(Kolbenbolzen für Leichtbau-Design):
KoBoLD: Kolbenbolzen für Leichtbau-Design
PD Dr.-Ing. Heinz Werner Höppel
(01.01.2017 - 31.12.2019)
QTeK: Qualitätstechniken
Prof. Dr.-Ing. Tino Hausotte
(01.08.2013 - 31.08.2014)
Kooperatives Promotionskolleg „Bildung als Landschaft. Zum Verhältnis von formalen und non-formalen Bildungsorten sowie formellem und informellem Lernen im Kindes- und Jugendalter“
Prof. Dr. Sabine Martschinke; Prof. Dr. Annette Scheunpflug
(11.07.2013 - 01.01.2016)


Publikationen in Kooperation mit FAU-Wissenschaftlerinnen und Wissenschaftlern


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Auernhammer, K., Tavakoli Kolagari, R., & Zoppelt, M. (2019). Attacks on machine learning: Lurking danger for accountability. In Proceedings of the 2019 AAAI Workshop on Artificial Intelligence Safety, SafeAI 2019. CEUR-WS.
Deitsch, S., Christlein, V., Berger, S., Buerhop-Lutz, C., Maier, A., Gallwitz, F., & Riess, C. (2019). Automatic Classification of Defective Photovoltaic Module Cells in Electroluminescence Images. Solar Energy, 185, 455-468. https://dx.doi.org/10.1016/j.solener.2019.02.067
Deitsch, S., Christlein, V., Berger, S., Buerhop-Lutz, C., Maier, A., Gallwitz, F., & Rieß, C. (2019). Automatic Classification of Defective Photovoltaic Module Cells in Electroluminescence Images. Solar Energy, 185, 455-468. https://dx.doi.org/10.1016/j.solener.2019.02.067
Knoll, J., Stübinger, J., & Grottke, M. (2019). Exploiting social media with higher-order Factorization Machines: statistical arbitrage on high-frequency data of the S&P 500. Quantitative Finance, 19(4), 571-585. https://dx.doi.org/10.1080/14697688.2018.1521002
Zoppelt, M., & Tavakoli Kolagari, R. (2019). SAM: A Security Abstraction Model for Automotive Software Systems. Springer Verlag.
Zoppelt, M., & Tavakoli Kolagari, R. (2019). UnCle SAM : Modeling Cloud Attacks with the Automotive Security Abstraction Model. In CLOUD COMPUTING 2019, The Tenth International Conference on Cloud Computing, GRIDs, and Virtualization (pp. 67--72). Venice, Italy.
Schirmer, J., Roudenko, J., Reichenberger, M., Neermann, S., & Franke, J. (2018). Adhesion Measurements for Printed Electronics: A Novel Approach to Cross Cut Testing. In IEEE Xplore (Eds.), Proceedings of the 41st International Spring Seminar on Electronics Technology (ISSE). Zlatibor.
Köppel, M., Werzinger, S., Ringel, T., Bechtold, P., Thiel, T., Engelbrecht, R.,... Schmauß, B. (2018). Combined distributed Raman and Bragg fiber temperature sensing using incoherent optical frequency domain reflectometry. Journal of Sensors and Sensor Systems. https://dx.doi.org/10.5194/jsss-7-91-2018
Franz, D., Dreher, M., Prinzen, M., Teßmann, M., Palm, C., Katzky, U.,... Wittenberg, T. (2018). CT-basiertes virtuelles Fräsen am Felsenbein --- Bild- und haptische Wiederholfrequenzen bei unterschiedlichen Rendering Methoden. In Andreas Maier, Thomas M. Deserno, Heinz Handels, Klaus Hermann Maier-Hein, Christoph Palm,Thomas Tolxdorff (Hrg.), Bildverarbeitung für die Medizin 2018 Algorithmen - Systeme - Anwendungen. Proceedings des Workshops vom 11. bis 13. März 2018 in Erlangen (pp. 176-181). Erlangen: Heidelberg: Springer.
Roudenko, J., Schirmer, J., Reichenberger, M., Neermann, S., & Franke, J. (2018). Influence of convection sintering parameters on electrical conductivity and adhesion of inkjet-printed silver nanoparticle inks on flexible substrates. In IEEE (Eds.), Proceedings of the 13th International Congress Molded Interconnect Devices (MID).
Schirmer, J., Eisen, K., Reichenberger, M., Roudenko, J., Neermann, S., & Franke, J. (2018). Long-Term Behavior of SMT Components Mounted on Printed Polymer Thick Film Pastes. In IEEE (Eds.), Proceedings of the 13th International Congress Molded Interconnect Devices (MID).
Schirmer, J., Roudenko, J., Reichenberger, M., Neermann, S., & Franke, J. (2018). Print Quality Assessment by Image Processing Methods for Printed Electronics Applications. In Proceedings of the 2018 41st International Spring Seminar on Electronics Technology (ISSE). Zlatibor, RS.
Deitsch, S., Buerhop-Lutz, C., Maier, A., Gallwitz, F., & Rieß, C. (2018). Segmentation of Photovoltaic Module Cells in Electroluminescence Images. arXiv.
Neermann, S., Scheetz, M., Franke, J., Roudenko, J., Schirmer, J., & Reichenberger, M. (2018). Substrate pretreatments: an investigation of the effects on aerosol jet printed structures. In Schmitt, Schuh (Hg.) 2018 – Advances in Production Research (Eds.), Proceedings of the WGP-Jahreskongress.
Particke, F., Schmidt, A., Rügheimer, C., & Mahr, T. (2017). Additive random sampling for radar signal processing. In 2017 IEEE-APS Topical Conference on Antennas and Propagation in Wireless Communications (APWC) (pp. 93-96). Verona, IT.
Alicajic, E., Rügheimer, C., Schmidt, A., Particke, F., & Mahr, T. (2017). FPGA-implementation of a target detector for nonuniform samples. In 2017 18th International Radar Symposium (IRS) (pp. 1-9). Prague, Czech Republic.
Katona, S., Koch, M., & Wartzack, S. (2016). An Approach of a Knowledge-based Process to Integrate Real Geometry Models in Product Simulations. Procedia CIRP, 50, 813-818. https://dx.doi.org/10.1016/j.procir.2016.04.176
Dotenco, S., Dalsaß, M., Winkler, L., Wurzner, T., Brabec, C., Maier, A., & Gallwitz, F. (2016). Automatic detection and analysis of photovoltaic modules in aerial infrared imagery. In Proceedings of the IEEE Winter Conference on Applications of Computer Vision, WACV 2016. Institute of Electrical and Electronics Engineers Inc..
Lušić, M., Katona, S., & Hornfeck, R. (2016). Compensating Deviations During Flexible Pin-type Moulding of Spatially Curved CFRP by Using 3D-Surface Detection. Procedia CIRP, 55, 158-163. https://dx.doi.org/10.1016/j.procir.2016.08.028
Datta, S., Choi, J.-H., Niebler, C., Maier, A., Fahrig, R., & Müller, K. (2016). Dual-Energy C-arm CT in the Angiographic Suite. In 2015 IEEE Nuclear Science Symposium and Medical Imaging Conference Record (NSS/MIC) (pp. pp). San Diego, CA, USA.

Zuletzt aktualisiert 2016-01-12 um 13:54