Hochschule für Angewandte Wissenschaften Hof

University / College


Location: Hof, Germany (DE) DE

ISNI: 0000000405662839

ROR: https://ror.org/04q5vv384

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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

From
To

Abstract

Journal

Profiling with trust: system monitoring from trusted execution environments (2024) Eichler C, Röckl J, Jung B, Schlenk R, Müller T, Hönig T Journal article Clinical and immunological benefits of full primary COVID-19 vaccination in individuals with SARS-CoV-2 breakthrough infections: A prospective cohort study in non-hospitalized adults (2024) Prelog M, Jeske SD, Asam C, Fuchs A, Wieser A, Gall C, Wytopil M, et al. Journal article Preliminary Studies and Prototypes for Machine Learning Based Evaluation of Surfers’ Performance on River Waves (2023) Zöllner M, Kniesburges S, Döllinger M, Gemeinhardt J, Krause M Conference contribution Towards an Empirical Study to Determine the Effectiveness of Support Systems against E-Mail Phishing Attacks (2023) Schiller K, Adamsky F, Benenson Z Conference contribution Veto: Prohibit Outdated Edge System Software from Booting (2023) Röckl J, Wagenhäuser A, Müller T Conference contribution Trusted Monitor: TEE-Based System Monitoring (2022) Jung B, Eichler C, Röckl J, Schlenk R, Hönig T, Müller T Conference contribution, Conference Contribution Compiler-Aided Development of Trusted Enclaves with Rust (2022) Dreissig F, Röckl J, Müller T Conference contribution VANDALIR: Vulnerability Analyses Based on Datalog and LLVM-IR (2022) Schilling J, Mueller T Conference contribution Evaluation of Mechanical Stress on Electronic Assemblies during Thermoforming and Injection Molding for Conformable Electronics (2021) Schirmer J, Reichenberger M, Wimmer A, Reichel H, Neermann S, Franke J Conference contribution Long-term electromigration study of lead-free flip-chips with solder bumps with 50 μm or 60 μm diameter employing ENIG surface finish on both chip and substrate side (2013) Gorywoda M, Dohle R, Härter S, Wirth A, Goßler J, Franke J Conference contribution