East China University of Science and Technology (ECUST)

University / College


Location: Shanghai, China (CN) CN

ISNI: 0000000121634895

ROR: https://ror.org/01vyrm377

Show on Map:


close-button

Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

From
To

Abstract

Journal

Copper Modified Boron Nitride And Graphene Combined To Self-Assemble Three-Dimensional Thermal Conductivity Framework to Improve the Thermal Conductivity of Epoxy Resin (2024) Li S, Wu W, Drummer D, Tomiak F, Wang Y, Lu Z, Zhao X Journal article SiC Nanowires Bridged Graphene Aerogels with a Vertically Aligned Structure for Highly Thermal Conductive Epoxy Resin Composites and Their Mechanism (2023) Zhao X, Wu W, Drummer D, Wang Y, Cui S, Liu C, Lu Z, et al. Journal article Copper and graphene work together to construct a three-dimensional skeleton thermal conductivity network to improve the thermal conductivity of the epoxy resin (2023) Li S, Wu W, Drummer D, Wang Y, Lu Z, Zhao X Journal article ZnO nanowire-decorated Al2O3/graphene aerogel for improving the thermal conductivity of epoxy composites (2023) Lu Z, Wu W, Drummer D, Wang Y, Liu C, Li S, Zhao X Journal article Significantly enhanced thermal conductivity of polymer composites via establishing double-percolated expanded graphite/multi-layer graphene hybrid filler network (2021) Liu C, Wu W, Drummer D, Wang Y, Chen Q, Liu X, Schneider K Journal article Multi-contact hybrid thermal conductive filler Al2O3@AgNPs optimized three-dimensional thermal network for flexible thermal interface materials (2021) Huang Z, Wu W, Drummer D, Liu C, Wang Y, Wang Z Journal article Enhanced the thermal conductivity of polydimethylsiloxane via a three-dimensional hybrid boron nitride@silver nanowires thermal network filler (2021) Huang Z, Wu W, Drummer D, Liu C, Wang Y, Wang Z Journal article Achieving a 3D thermally conductive while electrically insulating network in polybenzoxazine with a novel hybrid filler composed of boron nitride and carbon nanotubes (2020) Wang Y, Wu W, Drummer D, Liu C, Tomiak F, Schneider K, Huang Z Journal article Improvement of thermal conductivity and mechanical properties for polybenzoxazine composites via incorporation of epoxy resin and segregated structure (2020) Wang Y, Wu W, Drummer D, Liu C, Tomiak F, Schneider K Journal article Highly thermally conductive polybenzoxazine composites based on boron nitride flakes deposited with copper particles (2020) Wang Y, Wu W, Drummer D, Liu C, Shen W, Tomiak F, Schneider K, et al. Journal article
1 2 3 4