Challenges of Contacting Processes for Thin Copper Flat Wires in the Context of Electromechanical Engineering - Seefried, Johannes; Mahr, Alexander; Weigelt, Michael; Kühl, Alexander; Franke, Jörg (2021 11TH INTERNATIONAL ELECTRIC DRIVES PRODUCTION CONFERENCE (EDPC), 2021)
CRIS-Team WoS Importer:2022-04-29